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A Bibliography on Capacity Modeling for Semiconductor Manufacturing
Section 18: Lot Sizes, Wafer Size, and Single Wafer Processing
 | O. Bonnin, D. Mercier, D. Levy, M. Henry, I. Pouilloux, and E.
Mastromatteo, "Single-Wafer/Mini-Batch Approach for Fast Cycle Time in
Advanced 300- mm Fab," IEEE Transactions on Semiconductor
Manufacturing, Vol. 16, No. 2, 111-120, 2003. |
| J. Bukchin, M. Tzur, M. Jaffe, Lot Splitting to Minimize Average Flow-Time
in a Two-Machine Flow-Shop, IIE Transactions, Vol. 34, No. 11, 953-970,
2002. |
| T. F. Carmon and S. Nahmias, "A Preliminary Model for Lot Sizing in
Semiconductor Manufacturing," International Journal of Production
Economics, Vol. 35, 259-264, 1994. |
| K. C. Chen, H. H. Shih, Y. L. Hwang, C. C. Hsueh, H. Chung, S. Pan, C. Y.
Lu, "Applications of Single-Wafer Rapid-Thermal Processing to the
Manufacture of Advanced Flash Memory," IEEE Transactions on
Semiconductor Manufacturing, Vol. 16, No. 2, 128-137, 2003. |
| D. P. Connors and D. D. Yao, "Methods for Job Configuration in
Semiconductor Manufacturing," IEEE Transactions on Semiconductor
Manufacturing, Vol. 9, No. 3, 401-411, 1996. |
| S. Y. Hsu, T. Y. Wang, H. H. Shih, K. C. Chen, Y. L. Hwang, C. C. Hsueh,
H. Chung, S. Pan, and C. Y. Lu, "Applications of Single-Wafer Thermal
Processing to 0.15-mu m High-Density MROM," IEEE Transactions on
Semiconductor Manufacturing, Vol. 16, No. 2, 147-154, 2003. |
| S. Ikeda, K. Nemoto, M. Funabashi, T. Uchino, H. Yamamoto, N. Yabuoshi, Y.
Sasaki, K. Komori, N. Suzuki, S. Nishihara, S. Sasabe, and A. Koike,
"Process Integration of Single-Wafer Technology in a 300-Mm Fab,
Realizing Drastic Cycle Time Reduction with High Yield and Excellent
Reliability," IEEE Transactions on Semiconductor Manufacturing, Vol.
16, No. 2, 102-110, 2003. |
| U. S. Karmarkar, "Lot Sizes, Lead Times and In-Process
Inventories," Management Science, Vol. 33, No. 3, 409-418, 1987. |
| U. S. Karmarkar, "Notes: Lot-Sizing and Sequence Delays,"
Management Science, Vol. 33, No. 3, 419-423, 1987. |
| Uday S. Karmarkar, Sham Kekre, Sunder Kekre, and Susan Freeman,
"Lot-Sizing and Lead-time Performance in a Manufacturing Cell,"
Interfaces, Vol. 15, No. 2, 1-9, 1985. |
| H. Lee, "Lot Sizing to Reduce Capacity Utilization in A Production
Process with Defective Items, Process Corrections, and Rework,"
Management Science, Vol. 38, No. 9, 1314-1328, 1992. |
| J. Pettinato, "Technology Decisions to Attain a Risk-Minimized 450mm
Wafer Size Transition," Proceedings of the 2004 International Symposium
on Semiconductor Manufacturing (ISSM 2004), Tokyo, Japan, 2004. |
| J. Potoradi, G. Winz, and L. W. Kam, "Determining Optimal Lot-Size
For A Semiconductor Back-End Factory," Proceedings of the 1999 Winter
Simulation Conference, 1999. |
| M. K. Salameh, M. Y. Jaber, and N. Noueihed, "Effect of Deteriorating
Items on the Instantaneous Replenishment Model," Production Planning
& Control, Vol. 10, No. 2, 175-180, 1999. |
| K. Schuegraf, "Single-Wafer Process Technology: Enabling Rapid
SiGeBiCMOS Development," IEEE Transactions on Semiconductor
Manufacturing, Vol. 16, No. 2, 121-127, 2003. |
| T. Segal, "COMBAS: Cascading Optimization of Non Standard Machines
Wafer Loading Configuration," Proceedings of the 2004 International
Symposium on Semiconductor Manufacturing (ISSM 2004), Tokyo, Japan, 2004. |
| R. Singh, M. Fakhruddin, and K. F. Poole, "The Impact of Single-Wafer
Processing on Semiconductor Manufacturing," IEEE Transactions on
Semiconductor Manufacturing, Vol. 16, No. 2, 96-101, 2003. |
| D. Trietsch and K. R. Baker, "Basic Techniques for Lot
Streaming," Operations Research, Vol. 41, No. 6, 1065-1076, 1993. |
| E.J.J. van Campen, "Lot Size Optimization in 300mm 90nm Production
for Ultra-Short Cycle Times," Proceedings of the 2004 International
Symposium on Semiconductor Manufacturing (ISSM 2004), Tokyo, Japan, 2004. |
| R. A. Weimer, D. M. Eppich, K. L. Beaman, D. C. Powell, and F. Gonzalez,
"Contrasting Single-Wafer and Batch Processing for Memory
Devices," IEEE Transactions on Semiconductor Manufacturing, Vol. 16,
No. 2, 138-146, 2003. |
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